Hongfeng Mechanical Equipment Manufactory
Main products:Magnetron Sputtering Coating System,Magnetron Sputtering System With Two Chambers,ARC Deposition Coating Machine,Evaporation And Magnetron Sputtering Coating Machine,Plastic Metallizing Machine With Two Chambers
Products
Contact Us
  • Contact Person : Ms. Lau Jane
  • Company Name : Hongfeng Mechanical Equipment Manufactory
  • Tel : 86-731-58282058
  • Fax : 86-731-55567993
  • Address : Hunan,Xiangtan,No. 8 Yanjiang East Road, Yuhu District
  • Country/Region : China
  • Zip : 411100

PVD Sputtering coating plants

PVD Sputtering coating plants
Product Detailed
PVD coating plants

PVD sputtering coating plants

VACUUM METALIZING (Sputter Coating Process)GENERAL:A variation on Vacuum Metalizing (Filiment Evaporation/Cathode Arch/Sputter) called "Low Pressure Deposition." • Does not utilize complete atmosphere removal (vacuum) • Utilizes a basecoat, but a highly polished mold/amorphous materials don't need.• Deposition is very uniform and controlled.• Creates a very bright appearance (varies with thickness & basecoat color) • Materials that oxidize must be top coated - is metalizing, not plating.• Aluminum oxides, chrome, stainless steel.• Does not oxidize - no top coat required.

 

SPUTTER COATING PROCESS

 

• Parts are sprayed with a basecoat (becoming obsolete    in new technology with highly polished molds using amorphous materials).• Parts are racked, racks put into the chamber, the chamber is then sealed.• Argon gas is introduced into the chamber in a continuously flowing manner.• Electricity creates an active Argon plasma field in front of the cathode. (The cathode is an assembly which contains magnets and provides a mounting for the    target - a plate of the material which will be deposited.   The magnets are located behind the target.)• The positively charged (ionized) Argon atoms are    accelerated by passing through a magnetic field(created by magnets inside the cathode).• The positive atoms are attracted to the negative   charged cathode which contains the target.• The target is bombarded with each ion particle, they individually break off ("chip") an atom of the target material with each collision (target hit continuously).• Continuous (and directed) sputteing of tghe release target atoms are "shot" onto the surface of the part    (direction is assisted by the magnetic field - perpendicular to the target.• The basecoat material/paint (or high gloss amorphous part) provides a smooth surface for the atoms to be deposited together and build up on the part.• The part is top coated with HMDSO (in monomer form, polymerized by passing through a plasma created by high voltage rods - the polymer condensates onto the coating surface).• The chamber is vented and parts removed/reloaded.

PVD Sputtering coating plants



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